Wire-Bondable Multilayer Ceramic Capacitors
Our Wire-Bondable Multilayer Ceramic Capacitors are very thin, compact and have relatively high capacitance. Good wire-bondability by plating Au on electrode terminals. Suitable for mounting inside densely packed IC packages.
Series
Name
Applications
Y Series
IC, optical devices for telecommunication and measurement equipment.
Related Information
Please find additional information related to our Wire-Bondable Multilayer Ceramic Capacitors here.
PDF
O
Ceramic Substrates
O
Metallized / Multilayer Ceramic Substrate
O
Pressed Ceramic Products
O
Inductors
O
Capacitors
O
EMC Components
MARUWA CO., LTD.