Metallization Types
Thin Film Metallization

MARUWA has implemented manufacturing from the material and metallization processes by combining both technologies which were cultivated in-house for many years. The materials permit the production of sophisticated circuit patterns that meet customers’ needs with high-degree integration and electric properties by using substrates which have excellent thermal conductivity, such as alumina substrates, aluminium nitride substrates, multilayered substrates, or dielectric ceramics.
List of Products
Name
Applications
Thin Film Metallized Substrates
Applied circuit substrates for optical communication markets, circuit substrates for high frequency markets
Related Information
Please find additional information related to our Thin Film Metallization here.
O
Ceramic Substrates
O
Metallized / Multilayer Ceramic Substrate
O
Pressed Ceramic Products
O
Inductors
O
Capacitors
O
EMC Components
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