List of Products
Name
Applications
High Temperature Co-fired Substrates (HTCC)
Ceramic heater, Optical communication package, LED package, Sensor package, SMD package, Hybrid IC with power line, Compact module replacing mother board, MEMS (Micro Electro Mechanical Systems) package
Multilayer Co-fired Substrates

These substrates are co-fired in high temperature after patterning and lamination by using Alumina or Aluminium nitride. Both products have excellent thermal conductivity. The structure (surface with electrode patterning, inside with circuit patterning, and bottom with resistor/electrode patterning) has achieved substrates with smaller size and multifunction.
O
Ceramic Substrates
O
Metallized / Multilayer Ceramic Substrate
O
Pressed Ceramic Products
O
Inductors
O
Capacitors
O
EMC Components
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